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	1.	Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials [electronic resource] / John H. Lau ... [et al.]. by Lau, John H Series: McGraw-Hill's AccessEngineering Material type: Text; Format: available online ; Literary form: Not fiction ; Audience: Specialized; Publication details: New York : McGraw-Hill, [2003] Online resources: Subscription required Availability: No items available. Add to cart (remove)
	2.	3D IC integration and packaging / John H. Lau. by Lau, John H [author.] Material type: Text; Format: electronic available online Language: English Publisher: New York, N.Y. : McGraw-Hill Education LLC., c2016Copyright date: ©2016 Online resources: Click here to access online Availability: No items available. Add to cart (remove)
	3.	Reliability of RoHS-Compliant 2D and 3D IC interconnects [electronic resource] / John H. Lau. by Lau, John H Series: McGraw-Hill's AccessEngineering \| McGraw-Hill electronic engineering series Material type: Text; Format: available online ; Literary form: Not fiction ; Audience: Specialized; Publication details: New York : McGraw-Hill, [2011] Online resources: Subscription required Availability: No items available. Add to cart (remove)
	4.	Microvias : for low-cost, high-density interconnects [electronic resource] / John H. Lau, S.W. Ricky Lee. by Lau, John H Lee, S. W. Ricky Series: McGraw-Hill's AccessEngineering Material type: Text; Format: available online ; Literary form: Not fiction ; Audience: Specialized; Publication details: New York : McGraw-Hill, [2001] Online resources: Subscription required Availability: No items available. Add to cart (remove)
	5.	Through-Silicon Vias for 3D Integration / John H. Lau. by Lau, John H [author.] Material type: Text; Format: electronic available online Language: English Publisher: New York, N.Y. : McGraw-Hill Education LLC., c2013Copyright date: ©2013 Online resources: Click here to access online Availability: No items available. Add to cart (remove)